Seems to pass fine. Lower temperature than even the XTU test. According to HWMonitor, the max package power is around 60W for your ITT, while for the XTU it's around 80-90W. When you run the small FFTs in the latest version of Prime95 it's around 150W. The TDP is only 88W, suggesting Intel never considering running 4/8 threads of this instruction at 100% a typical use case. I had a short search around, and couldn't find a maximum die to spreader (or something similar) rating. Is there actually a maximum thermal dissipation (vs the average TDP based on an Intel specified workload) documented somewhere for the package?